Topic: [WIIU] 1x update

http://redump.org/disc/41214/

New info:

Case Barcode: 5 051895 239421 >
Case Serial: TSA-WUP-ALMP-SCN

Mastering Code: 613I3001 WUP-P-ALMP-00 JPN S0
Mastering SID Code (back): IFPI LL40
Mould SID Code (back): None
Additional Mould Text (back): None
Toolstamp (back): F1
Mould SID Code (front): IFPI HHUK
Additional Mould Text (front): MADE IN JAPAN

Re: [WIIU] 1x update

Is this a verification? It should go in the Dumps section if it is.

If not, then I can add the barcode/case info. The Ring info can only be added if the hashes match the entry.